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Diane Publishing Books
Semiconductor Packaging: A DoD Dual Use Technology Assessment
. This assessment concludes that commercial capabilities for single chip semiconductor packaging are sufficient to assure affordable access to meet military needs. Driven by markets in telecomm., computers, consumer electronics, & automotive systems, the integrated circuit (IC) packaging industry is able to provide the mainstream packaging technology required by the DoD. Although predominantly offshore, IC assemblers & equip. suppliers are highly competitive & diversified. Packaging materials suppliers are concentrated in Japan, but there is no indication that access to materials will be limited or denied.
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